On 3/30/2017, Shares of Ultragenyx Pharmaceutical Inc. (NASDAQ:RARE) closed at $67.30 in last trading day. After noting the initial trading entry at $66.59, it reached to a day’s high of $67.44 and moved to a day’s low of $65.55. The recent daily volume was 543.44 thousand as contrast to it’s an average volume of 489.34 thousand.
The last close of the Ultragenyx Pharmaceutical Inc. stock reflects that it traded -15.40% from its 50-day moving average of $79.55. The stock traded below -8.46% to its 200-day MA of $73.52. Furthermore, it moved lower -26.32% from its 52-week high of $91.35 and +44.67% up from $46.52, which is 52-week low of the stock.
Ultragenyx Pharmaceutical Inc.’s (RARE) moved with shift of -6.51% in the past week. Over the last three months, the shares of the company have changed -5.50% and performed -5.95% over the last six months. The stock currently has Monthly Volatility of 4.24% and Weekly Volatility of 4.34%.
Ultragenyx Pharmaceutical Inc., a clinical-stage biopharmaceutical company, focuses on the identification, acquisition, development, and commercialization of various products for the treatment of rare and ultra-rare genetic diseases in the United States. The company is developing various biologics product candidates, including KRN23, a human monoclonal antibody that in Phase III adult study to bind and reduce the biological activity of fibroblast growth factor 23 to enhance abnormally low phosphate levels in patients with X-linked hypophosphatemia, as well as for the treatment of tumor-induced osteomalacia. Its biologics product candidates also comprise recombinant human beta -glucuronidase (rhGUS), an enzyme replacement therapy, which completed the Phase 3 clinical study for the treatment of mucopolysaccharidosis 7; and recombinant human protective protein cathepsin-A (rhPPCA), an enzyme replacement therapy, which is in preclinical development for galactosialidosis. The company is also developing range of small-molecule product candidates, such as UX007, a substrate replacement therapy that is in Phase II study for patients with fatty acid oxidation disorders, as well as for patients with glucose transporter type-1 deficiency syndrome; and aceneuramic acid extended-release (Ace-ER), an oral formulation of sialic acid, which is in Phase III extension study to treat GNE myopathy. It has collaboration and license agreements with Arcturus Therapeutics, Inc.; Takeda Pharmaceutical Company Limited; Kyowa Hakko Kirin Co. Ltd.; Saint Louis University; Baylor Research Institute; Nobelpharma Co., Ltd.; Alcami Corporation; HIBM Research Group; and St. Jude Children’s Research Hospital. The company was founded in 2010 and is headquartered in Novato, California.
Advanced Semiconductor Engineering, Inc. (NYSE:ASX) finalized the last transaction at value of $6.59, with a daily change of -0.45% or -0.03 points. The company maintained volume of 518.89 thousand shares. In past trading day, the stock hit the maximum price of $6.60 and touched to minimum value of $6.54. It has a market cap of $ 10.12B.
As of last trade close, the stock is trading downside -0.75% from its one year high of $6.64 and moved +49.94% upward from $4.39, which is one year low of the stock.
The stock traded above +5.25% from its 50-day moving average of $6.26. Furthermore, the stock moved up +14.32% to its 200-day MA of $ 5.76.
During the last month, Advanced Semiconductor Engineering, Inc.’s (ASX) has changed 7.33% and performed 11.32% over the last 6 months. The mean rating score for this stock is at 1.30. This rating scale contains from 1 to 5 with 5 representing a Strong Sell, 1 signifying a Strong Buy and 3 demonstrating a Hold. The Volatility was noted at 1.44% in recent month and observed Weekly Volatility of 1.07%.
Advanced Semiconductor Engineering, Inc. provides semiconductor packaging and testing services in the United States, Taiwan, Asia, Europe, and internationally. It operates through Packaging, Testing, and Electronic Manufacturing Services segments. The company offers packaging services, including various packages, such as flip-chip ball grid array (BGA), flip-chip chip scale package, advanced chip scale packages, quad flat packages, thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, plastic BGAs, and 3D chip packages; stacked die solutions in various package types; and copper wire and silver bonding solutions. It also provides advanced packages, including wafer level chip scale, flip-chip (FC) chip scale, FC package in, FC BGA/HF FCBGA, FC and wire bonding, and integrated passive device packages; IC wire bonding packages, including lead frame-based package types, such as lead frame-based packages and substrate-based packages; system-in-package (SiP) products, as well as module assembly services; and interconnect materials. In addition, the company offers a range of semiconductor testing services, including front-end engineering testing, wafer probing, logic/mixed-signal/RF module and SiP/ MEMS/discrete final testing, and test-related services, as well as drop shipment services. Further, it provides electronic manufacturing services in relation to computers, peripherals, communications, industrial, automotive, and storage and server applications. Advanced Semiconductor Engineering, Inc. was founded in 1984 and is based in Kaohsiung, Taiwan.